SimpleLink™ cc13xx_cc26xx SDK 7.10.01.24 Release Notes
Table of Contents
Introduction
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This is version 7.10.01.24 of the SimpleLink Low Power F2 SDK.
Documentation
What’s New
- Added device support and characterized settings for CC2674R10 and CC2674P10
- Updated CC2642R-Q1 device PA tables to correct TX output power setting
Refer to the Document Overview for the individual release notes and details for starting development with each SDK component.
Refer to the included Change Log for a summary of new features and fixed issues since the last SDK release.
Upcoming Features
- TI OpenThread example projects will be removed from the Low Power F2 SDK in 3Q 2023. TI OpenThread example projects will be made available outside the Low Power F2 SDK in an open source repository. Notably, a key application enabled by this is Matter.
Upgrade and Compatibility Information
- Most example projects in the SDK use SysConfig to configure RF stacks, multi-protocol functionality, CCFG, drivers and peripherals. For more information about SysConfig, see SimpleLink Academy.
- If you want to migrate from one device to another within the same SDK, you can use the SysConfig Migration Tool. Learn more about it in the SysConfig migration documentation.
- TI-RTOS7 based examples will consume additional flash memory for CC13x2/CC26x2 and CC13x2R7/CC26x2R7 devices when compared to legacy TI-RTOS examples.
Operating System Support
- Windows® Windows 10
- Ubuntu 20.04 LTS 64-bit
- macOS Catalina
Dependencies
SimpleLink Low Power F2 SDK 7.10.01.24 was built & tested on a Windows host platform using the following Integrated Development Environments (IDEs) and components. Using an IDE or toolchain version not listed below may result in compatibility issues with this SDK release. Refer to the individual component release notes in the Document Overview for each component’s supported code generation tools.
- IAR Embedded Workbench: EWARM-9.32.1
- TI Code Composer Studio: CCS-12.2.0
- TI ARM Clang Compiler tools: 2.1.2.LTS
- XDCTools: 3.62.01.15
- ARM GCC: gcc-arm-none-eabi-9-2019-q4-major
- SysConfig Standalone tool for IAR IDE: 1.16.2
- FreeRTOS: 202104.00
Device Support
This SDK supports the following SimpleLink CC13xx and CC26xx wireless MCUs:
| Sub-1GHz Devices | 2.4GHz Devices | Dual Band Devices |
|---|---|---|
| CC1311P3 | CC2642R | CC1352P |
| CC1311R3 | CC2642R-Q1 | CC1352P7 |
| CC1312R | CC2651P3 | CC1352R |
| CC1312R7 | CC2651R3 | CC1354P10 (Preliminary) |
| CC1312PSIP | CC2652P | CC1354R10 (Preliminary) |
| CC1314R10 | CC2652P7 | |
| CC2652R | ||
| CC2652RB | ||
| CC2652R7 | ||
| CC2652RSIP | ||
| CC2652PSIP | ||
| [CC2651RS3IPA][CC2651R3SIPA] | ||
| CC2674R10 | ||
| CC2674P10 |
Development Board Support
The following table lists the supported development boards for each device supported in this SDK. Note: LaunchPad™ Development kits are not available for all device variants. As such, alternative options for development are presented in this table.
A Modular LaunchPad™ must be used together with the Modular LaunchPad™ Emulator (an LP-XDS110 or LP-XDS110ET).
Known Issues
- Some Core SDK libraries cannot be rebuilt. If any modifications to the core SDK are required, it is recommended to copy the necessary file to your project, make your customizations, and build your project with the modified file. Verify in your IDE that the modified file is being correctly linked and your project is not using the library.
- When a link needs to be established between a P and an R device, open the SysConfig file, select XOSC Cap Array modification in Device Configuration and set XOSC Cap Array Delta to 0xD5 on the P device
- For all SDK components, the importing of IAR projects through dev.ti.com is currently not supported
- Refer to the Document Overview for known issues and limitations as published in each SDK component’s release notes
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.