Modules
	Bonding Failure Actions

	GAP Bond Manager Bond read mode

	GAP Bond Manager ECC Re-use count before

	GAP Bond Manager I/O Capabilities

	GAP Bond Manager Key Distribution

	GAP Bond Manager Pairing Modes

	GAP Bond Manager Secure Connections options

	GAPBondMgr_Identical_IRK_Action

	Pairing failure status values

	SM AuthReq Bonding Flags

	SM I/O Capabilities

	SM Message opcocdes

	SM Passkey Types (Bit Masks)

Macros
#define	ECC_KEYLEN 32
	ECC Key Length: 256 bit keys. More...

#define	GAP_BOND_DEV_CSRK_OFFSET 4
	NV ID for the bonding records' device CSRK. More...

#define	GAP_BOND_DEV_IRK_OFFSET 3
	NV ID for the bonding records' device IRK. More...

#define	GAP_BOND_DEV_LTK_OFFSET 2
	NV ID for the bonding records' device LTK information. More...

#define	GAP_BOND_DEV_SIGN_COUNTER_OFFSET 5
	NV ID for the bonding records' device Sign Counter. More...

#define	GAP_BOND_LOCAL_LTK_OFFSET 1
	NV ID for the bonding record's local LTK information. More...

#define	GAP_BOND_REC_ID_OFFSET 0
	NV ID for the main bonding record. More...

#define	GAP_BOND_REC_IDS 6

#define	GAP_BONDED_STATE_AUTHENTICATED 0x01

#define	GAP_BONDED_STATE_CAR 0x04

#define	GAP_BONDED_STATE_NO_RECORD 0xFF

#define	GAP_BONDED_STATE_RPA_ONLY 0x10

#define	GAP_BONDED_STATE_SECURECONNECTION 0x08

#define	GAP_BONDED_STATE_SERVICE_CHANGED 0x02

#define	GAP_BONDED_STATE_UNAUTHENTICATED 0x00

#define	GAP_BONDINGS_MAX 10
	Maximum number of bonds that can be saved in NV. More...

#define	GAP_CHAR_CFG_MAX 4
	Maximum number of characteristic configuration that can be saved in NV. More...

#define	PASSKEY_LEN 6
	Passkey Character Length (ASCII Characters) More...

#define	SM_AUTH_MITM_MASK(a) (((a) & 0x04) >> 2)
	MITM Mask. More...

#define	SM_AUTH_STATE_AUTHENTICATED 0x04
	Authenticate requested. More...

#define	SM_AUTH_STATE_BONDING 0x01
	Bonding requested. More...

#define	SM_AUTH_STATE_SECURECONNECTION 0x08
	Secure Connection requested. More...

#define	SM_ECC_KEY_LEN 32
	ECC Key length in bytes. More...

#define	SM_ECC_KEYS_NOT_AVAILABLE 0xFF
	Initial state of recycled keys before they exist. More...

#define	SM_ECC_KEYS_REGENERATE_ALWAYS 0x00
	Always regenerate the keys. More...

#define	SM_ECC_KEYS_REGNENERATE_NEVER 0xFF
	Never regenerate the keys. More...

Detailed Description

Macro Definition Documentation

§ ECC_KEYLEN

#define ECC_KEYLEN 32

ECC Key Length: 256 bit keys.

§ GAP_BOND_DEV_CSRK_OFFSET

#define GAP_BOND_DEV_CSRK_OFFSET 4

NV ID for the bonding records' device CSRK.

§ GAP_BOND_DEV_IRK_OFFSET

#define GAP_BOND_DEV_IRK_OFFSET 3

NV ID for the bonding records' device IRK.

§ GAP_BOND_DEV_LTK_OFFSET

#define GAP_BOND_DEV_LTK_OFFSET 2

NV ID for the bonding records' device LTK information.

§ GAP_BOND_DEV_SIGN_COUNTER_OFFSET

#define GAP_BOND_DEV_SIGN_COUNTER_OFFSET 5

NV ID for the bonding records' device Sign Counter.

§ GAP_BOND_LOCAL_LTK_OFFSET

#define GAP_BOND_LOCAL_LTK_OFFSET 1

NV ID for the bonding record's local LTK information.

§ GAP_BOND_REC_ID_OFFSET

#define GAP_BOND_REC_ID_OFFSET 0

NV ID for the main bonding record.

GAP Bond Manager NV layout

The NV definitions: BLE_NVID_GAP_BOND_START - starting NV ID gapBond_maxBonds - Maximum number of bonding allowed (32 is max for number of NV IDs allocated in bcomdef.h).

A single bonding entry consists of 6 components (NV items): Bond Record - defined as gapBondRec_t and uses GAP_BOND_REC_ID_OFFSET for an NV ID local LTK Info - defined as gapBondLTK_t and uses GAP_BOND_LOCAL_LTK_OFFSET for an NV ID device LTK Info - defined as gapBondLTK_t and uses GAP_BOND_DEV_LTK_OFFSET for an NV ID device IRK - defined as "uint8_t devIRK[KEYLEN]" and uses GAP_BOND_DEV_IRK_OFFSET for an NV ID device CSRK - defined as "uint8_t devCSRK[KEYLEN]" and uses GAP_BOND_DEV_CSRK_OFFSET for an NV ID device Sign Counter - defined as a uint32_t and uses GAP_BOND_DEV_SIGN_COUNTER_OFFSET for an NV ID

When the device is initialized for the first time, all (gapBond_maxBonds) NV items are created and initialized to all 0xFF's. A bonding record of all 0xFF's indicates that the bonding record is empty and free to use.

The calculation for each bonding records NV IDs: MAIN_RECORD_NV_ID = ((bondIdx * GAP_BOND_REC_IDS) + BLE_NVID_GAP_BOND_START) LOCAL_LTK_NV_ID = (((bondIdx * GAP_BOND_REC_IDS) + GAP_BOND_LOCAL_LTK_OFFSET) + BLE_NVID_GAP_BOND_START)

§ GAP_BOND_REC_IDS

#define GAP_BOND_REC_IDS 6

§ GAP_BONDED_STATE_AUTHENTICATED

#define GAP_BONDED_STATE_AUTHENTICATED 0x01

§ GAP_BONDED_STATE_CAR

#define GAP_BONDED_STATE_CAR 0x04

§ GAP_BONDED_STATE_NO_RECORD

#define GAP_BONDED_STATE_NO_RECORD 0xFF

§ GAP_BONDED_STATE_RPA_ONLY

#define GAP_BONDED_STATE_RPA_ONLY 0x10

§ GAP_BONDED_STATE_SECURECONNECTION

#define GAP_BONDED_STATE_SECURECONNECTION 0x08

§ GAP_BONDED_STATE_SERVICE_CHANGED

#define GAP_BONDED_STATE_SERVICE_CHANGED 0x02

§ GAP_BONDED_STATE_UNAUTHENTICATED

#define GAP_BONDED_STATE_UNAUTHENTICATED 0x00

§ GAP_BONDINGS_MAX

#define GAP_BONDINGS_MAX 10

Maximum number of bonds that can be saved in NV.

§ GAP_CHAR_CFG_MAX

#define GAP_CHAR_CFG_MAX 4

Maximum number of characteristic configuration that can be saved in NV.

§ PASSKEY_LEN

#define PASSKEY_LEN 6

Passkey Character Length (ASCII Characters)

§ SM_AUTH_MITM_MASK

#define SM_AUTH_MITM_MASK ( a ) (((a) & 0x04) >> 2)

MITM Mask.

§ SM_AUTH_STATE_AUTHENTICATED

#define SM_AUTH_STATE_AUTHENTICATED 0x04

Authenticate requested.

§ SM_AUTH_STATE_BONDING

#define SM_AUTH_STATE_BONDING 0x01

Bonding requested.

§ SM_AUTH_STATE_SECURECONNECTION

#define SM_AUTH_STATE_SECURECONNECTION 0x08

Secure Connection requested.

§ SM_ECC_KEY_LEN

#define SM_ECC_KEY_LEN 32

ECC Key length in bytes.

§ SM_ECC_KEYS_NOT_AVAILABLE

#define SM_ECC_KEYS_NOT_AVAILABLE 0xFF

Initial state of recycled keys before they exist.

§ SM_ECC_KEYS_REGENERATE_ALWAYS

#define SM_ECC_KEYS_REGENERATE_ALWAYS 0x00

Always regenerate the keys.

§ SM_ECC_KEYS_REGNENERATE_NEVER

#define SM_ECC_KEYS_REGNENERATE_NEVER 0xFF

Never regenerate the keys.

Modules

Macros