SimpleLink™ CC13XX/CC26XX SDK TI Wi-SUN FAN 1.0 Stack User's Guide
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  • Wi-SUN Stack Quick Start Guide
  • SimpleLink Wireless MCU CC13xx and CC26xx Overview
  • TI-RTOS7 (RTOS Kernel) Overview
  • FreeRTOS (RTOS Kernel) Overview
  • TI Wi-SUN FAN Stack
    • Overview
    • What is a FAN?
    • Architecture Choices
    • Network Profiles
    • Data Rate and PHY
    • MAC and Frequency Hopping
    • Join Process
    • EAPOL Layer
    • 6LoWPAN Layer
    • IPv6 Layer
    • Routing Layer (RPL)
    • JP/EU Certification Features
    • FCC Certification Considerations
  • Advanced TI Wi-SUN FAN Stack Features
  • Wi-SUN Network Topology Management
  • TI Wi-SUN FAN NWP Interface Guide
  • Example Application Guide
  • Custom Hardware
  • Debugging
  • Memory overview
  • MCUBoot Over-the-Air Download (OAD)
  • System Configuration (SysConfig)
  • EnergyTrace User Guide
  • Migration Guide
  • References
  • Terms and Acronyms
SimpleLink™ CC13XX/CC26XX SDK TI Wi-SUN FAN 1.0 Stack User's Guide
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  • TI Wi-SUN FAN Stack

TI Wi-SUN FAN Stack¶

Table of contents

  • Overview
  • What is a FAN?
  • Architecture Choices
  • Network Profiles
  • Data Rate and PHY
  • MAC and Frequency Hopping
    • Broadcast Channel Hopping Schedule
    • Unicast Channel Hopping Schedule
  • Join Process
    • Joining State 1: Select PAN
    • Joining State 2: Authenticate
    • Joining State 3: Acquire PAN Config
    • Joining State 4: Configure Routing
    • Joining State 5: Operational
  • EAPOL Layer
    • Usage of NV for Storing Keys
    • Certificates for Certification
  • 6LoWPAN Layer
  • IPv6 Layer
  • Routing Layer (RPL)
  • JP/EU Certification Features
    • Minimum Tx Off Time
    • Duty-Cycling
  • FCC Certification Considerations
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